Impinj (PI), a wireless connectivity solutions provider, relies primarily on 300mm wafers to meet customer demand. In its latest quarterly filing, Impinj warned its foundry partner has signaled 300mm capacity is still tight, and will remain so into 2023. As a result, Impinj issued the following warning:

“...absent a significantly higher 2023 300mm wafer allocation over 2022, we will be unable to meet our 2023 endpoint IC demand, potentially by a significant amount.”

Importantly, the mix shift back to older generation 200mm wafers will result in lower performance ICs with fewer features but at higher costs. Consequently, Impinj also inserted new language in the filing warning of potential market share loss.